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Microvias: For Low Cost, High Density Interconnects

Unknown Author
4.9/5 (23730 ratings)
Description:State-of-the-art introduction to high-density interconnect technologyThe first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that's changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee's intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Microvias: For Low Cost, High Density Interconnects. To get started finding Microvias: For Low Cost, High Density Interconnects, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.
Pages
Format
PDF, EPUB & Kindle Edition
Publisher
McGraw-Hill Professional Publishing
Release
2001
ISBN
0071500472

Microvias: For Low Cost, High Density Interconnects

Unknown Author
4.4/5 (1290744 ratings)
Description: State-of-the-art introduction to high-density interconnect technologyThe first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that's changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee's intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Microvias: For Low Cost, High Density Interconnects. To get started finding Microvias: For Low Cost, High Density Interconnects, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.
Pages
Format
PDF, EPUB & Kindle Edition
Publisher
McGraw-Hill Professional Publishing
Release
2001
ISBN
0071500472
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